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The B760 DS3H represents a surgical fusion of legendary durability and next-generation connectivity. Designed for professionals who operate within zero-compromise computing environments, this motherboard utilizes a high-impact 8+1+1 phase hybrid digital VRM design to capture surgical power stability for high-performance CPUs. The specialized Ultra Durable architecture is surgically engineered to allow for high-velocity heat dissipation, acting as a reliable pillar for long-term system integrity and high-production multitasking. Whether you are managing a high-stakes tactical session or a high-production creative workload, this board provides the technical refinement and structural integrity required to maintain absolute technical dominance over your hardware.
Key Features
Intel LGA 1700 Socket Support: Meticulously designed for surgical compatibility with 14th, 13th, and 12th Gen Intel Core Series processors, acting as a reliable anchor for modern system builds.
PCIe Gen5 x16 Interface: Features high-velocity bandwidth surgically engineered to provide surgical throughput for the latest flagship graphics cards.
DDR5 Memory Optimization: Surgically designed to support high-velocity memory modules with XMP 3.0 profiles, acting as a reliable pillar for high-bandwidth multitasking.
Advanced Thermal Architecture: Equipped with high-impact enlarged heatsinks and specialized M.2 thermal guards, providing a surgical cooling advantage for sustained performance.
High-Velocity 2.5GbE LAN: Meticulously crafted for professional-grade networking, providing a high-impact link with surgical bandwidth and ultra-low latency in the UAE.
Dual PCIe 4.0 x4 M.2 Slots: Surgically engineered for high-velocity storage expansion, ensuring a surgical advantage in data loading speeds and storage density.
Q-Flash Plus Technology: Features a surgical BIOS update mechanism without the need for a CPU or memory, acting as a reliable anchor for easy system maintenance.
Smart Fan 6 Technology: Meticulously designed with multiple temperature sensors and hybrid fan headers, providing a high-impact cooling control system for flagship chassis.
Why This Product Stands Out
The GIGABYTE B760 DS3H stands out by offering flagship PCIe Gen5 performance and a specialized Ultra Durable architecture within a single high-velocity platform. While standard entry-level motherboards compromise on expansion speed, the Gen5 capability of the DS3H acts as a major differentiator, providing a surgical advantage in data transfer and future GPU compatibility. Its professional aesthetic and ultra-precise power delivery are high-impact benefits for users in the UAE who demand professional-grade hardware. For the PC builder who requires technical dominance and a flagship-tier B760 anchor, this motherboard offers a level of refinement and analytical excellence that redefines the Ultra Durable category.
Feature | Details |
|---|---|
Model | GIGABYTE B760 DS3H GEN5 |
Socket / Chipset | Intel LGA 1700 / B760 Express |
CPU Support | Intel® Core™ 14th, 13th, and 12th Gen Processors |
Memory | 4 x DDR5 DIMM (Max 256GB), 7600(OC) MT/s |
Expansion Slots | 1 x PCIe 5.0 x16 (Primary), 4 x PCIe 3.0 x16 (running at x1) |
Storage | 2 x M.2 (PCIe 4.0 x4), 4 x SATA 6Gb/s |
Rear USB | 1 x USB 3.2 Gen 2x2 Type-C (20Gbps), 1 x USB 3.2 Gen 2 (Type-A), 4 x USB 2.0 |
Front USB | 1 x USB 3.2 Gen 1 (Type-C Header), 2 x USB 3.2 Gen 1, 4 x USB 2.0 |
Networking | Realtek® GbE LAN (1 Gbps) |
Audio | Realtek® High Definition Audio (7.1-channel support) |
Form Factor | ATX (30.5 cm x 24.4 cm) |
Inclusive of VAT
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Home/PC Components/Motherboards/Intel Motherboards/GIGABYTE B760 DS3H Motherboard, Ultra Durable Seri...
Adarc Computer established in the year 2007, has emerged as a major constituent of the IT Re-distribution industry in every part of UAE. Currently, Adarc Computer is the authorized dealer of global leading brands.
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