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SKU : DM-KINGSTON 32GB 6000 AMD
Kingston FURY KF560C36BBEA-32 is a 4G x 64-bit (32GB)
DDR5-6000 CL36 SDRAM (Synchronous DRAM) 2Rx8, memory
module, based on sixteen 2G x 8-bit FBGA components per module.
The module supports AMD® EXPO v1.0 and Intel® Extreme
Memory Profiles (Intel® XMP) 3.0. Each module has been
tested to run at DDR5-6000 at a low latency timing of 36-38-38 at
1.35V. The SPDs are programmed to JEDEC standard latency
DDR5-4800 timing of 40-39-39 at 1.1V. Each 288-pin DIMM
uses gold contact fingers. The JEDEC standard electrical
Performance / Technology
This Kingston FURY module is built utilizing sixteen premium 2G x 8-bit FBGA components arranged in a 2Rx8 configuration. While the default JEDEC profile boots safely at standard DDR5-4800 speeds (1.1V), engaging the EXPO or XMP profiles unlocks its true potential. Pushing the memory to 6000MHz provides a massive leap in frequency, ensuring your modern multi-core processor is constantly fed with data.
Design & Compatibility
When planning your motherboard layout, utilizing a single 32GB stick is a highly deliberate and effective strategy. It immediately satisfies the heavy RAM requirements of modern software while keeping additional memory channels completely open. It perfectly accommodates compact Micro-ATX or Mini-ITX builds where physical slots are strictly limited, acting as a powerhouse foundation for your system architecture.
Why This Product Stands Out
The Kingston FURY 32GB KF560C36BBEA-32 stands out through its sheer versatility. By combining a massive single-stick capacity with cross-platform overclocking support and a highly compatible 42.23mm heatsink design, it provides builders with a premium, zero-headache component for top-tier desktop performance.
Feature | Specification |
|---|---|
Brand | KINGSTON |
Series | FURY |
Capacity | 32GB (Single Chip) |
Memory Type | DDR5 |
Speed | 6000MHz |
Latency Timing | CL36-38-38 (Tested) / 40-39-39 (JEDEC) |
Voltage | 1.35V (Tested) / 1.1V (Typical VDD/VDDQ) |
Profile Support | AMD EXPO v1.0 & Intel XMP 3.0 |
Module Configuration | 4G x 64-Bit, 2Rx8 (Sixteen 2G x 8-bit FBGA components) |
Form Factor | 288-Pin DIMM |
Special Features | On-Die ECC |
Physical Height | 1.66” (42.23mm) with heatsink |
Part Number | KF560C36BBEA-32 |
UPC | 740617331899 |